LOW TEMPERATURE THERMAL DEBINDING BEHAVIOR OF WAX-BASED MULTI-COMPONENT BINDER FOR TUNGSTEN HEAVY ALLOY①
(State Key Laboratoryfor Powder Metallury,Central South University of Technology, Changsha 410083, P. R. China)
Abstract: To control the defects in thermal debinding stage, low temperature thermal debinding behavior of wax in the multi-component binder for tungsten heavy alloy was studied. The wax burnout temperature is below 250℃, at which the defects mainly occur. The debinding rate is controlled by the diffusion of wax in the polymer to the inner surface of pores and then to the external environment. The experiment proved the amount of removed wax as an exponential function of time, the reciprocal sample thickness and temperature coeffcient.
Key words: thermal debinding multi-component binder tungsten heavy alloy