Comparison of microstructures in electroformed and spin-formed copper liners of shaped charge undergone high-strain-rate deformation
(1. School of Materials Science and Engineering, Beijing Institute of Technology,Beijing 100081, China; 2. Department of Materials Physics and Chemistry, University of Science and Technology Beijing, Beijing 100083, China )
Abstract: The as-formed and post-deformed microstructures in both electroformed and spin-formed copper liners of shaped charge were studied by optical microscopy(OM), electron backscattering Kikuchi patterns(EBSP) technique and transmission electron microscopy(TEM). The deformation was carried out at an ultra-high strain rate. OM analysis shows that the initial grains of the electroformed copper liner are finer than those of the spin-formed copper liners. Meanwhile, EBSP analysis reveals that the fiber texture exists in the electroformed copper liners, whereas there is no texture observed in the spin-formed copper liners before deformation. Having undergone high-strain-rate deformation the grains in the recovered slugs, which are transformed from both the electroformed and spin-formed copper liners, all become small. TEM observations of the above two kinds of post-deformed specimens show the existence of cellular structures characterized by tangled dislocations and subgrain boundaries consisting of dislocation arrays. These experimental results indicate that dynamic recovery and recrystallization play an important role in the high-strain-rate deformation process.
Key words: microstructures; copper liners; high-strain-rate deformation; dynamic recovery and recrystallization