ISSN: 1003-6326
CN: 43-1239/TG
CODEN: TNMCEW

Vol. 14    No. 2    April 2004

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Phase-field simulations of solidification of Al-Cu binary alloys①
LONG Wen-yuan(龙文元), CAI Qi-zhou(蔡启舟), CHEN Li-liang(陈立亮),
 WEI Bo-kang(魏伯康)
(State Key Laboratory of Die Technology, Huazhong University of Science and Technology,
Wuhan 430074, China
)
Abstract: The dendrite growth process during the solidification of the Al-4.5%Cu binary alloy was simulated using the phase-field model, proposed by Kim et al. Solute diffusion equation and heat transfer equation were solved simultaneously. The effects of the noise on the dendrite growth, solute and temperature profile in the undercooled alloy melt were investigated. The results indicate that the noise can trigger the growth of the secondary arms, and increase the highest temperature and solute concentration, but not influence the tip operating state. The solute and temperature gradients in the tip are the highest.
Key words: Al-Cu alloy; phase-field model; dendrite growth; solute profile; temperature profile
Superintended by The China Association for Science and Technology (CAST)
Sponsored by The Nonferrous Metals Society of China (NFSOC)
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