ISSN: 1003-6326
CN: 43-1239/TG
CODEN: TNMCEW

Vol. 14    No. 3    June 2004

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Modeling of microstructural evolution and flow stress of
aluminium alloy during thermomechanical process
SHEN Jian(沈 健)1, G.Gottstein2
(1. General Research Institute for Nonferrous Metals, Beijing 100088, China;
2. Institut für Metallkunde und Metallphysik, RWTH-Aachen, Germany
)
Abstract: The evolution of microstructural variables, including the densities of mobile dislocation, immobile dislocation at the cell interiors, immobile dislocation in the cell walls, as well as total dislocation density, of an Al-Mg-Si aluminium alloy during thermomechanical processing were simulated based on a three-internal-variables-model (3IVM) involving dislocation climb and interaction. Optimization was carried out to fit the calculated stress—strain curves to the experimental data of the Al-Mg-Si alloy with minimum mean deviation. Precipitations were taken into consideration of modeling. The stress—strain curves predicted by the kinetic equations of state in the 3IVM have a good agreement with the experimental data.
Key words: aluminium alloy; microstructure evolution; dislocation; modeling
Superintended by The China Association for Science and Technology (CAST)
Sponsored by The Nonferrous Metals Society of China (NFSOC)
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