Effect of bonding parameters on microstructure and properties of Si3N4/Si3N4 joint brazed by Cu-Zn-Ti filler alloy
(1. School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China;
2. Joining and Welding Research Institute, Osaka University, Ibaraki,
Osaka 567-0047, Japan)
2. Joining and Welding Research Institute, Osaka University, Ibaraki,
Osaka 567-0047, Japan)
Abstract: Si3N4 ceramic was jointed to Si3N4 ceramic using a filler alloy of Cu-Zn-Ti at 1123-1323K for 0.3-2.7ks. Ti content in the Cu-Zn-Ti filler alloy was 15%(molar fraction). The effect of bonding parameters on the microstructure and mechanical properties of the Si3N4/Si3N4 joint were investigated. The results indicate that with increasing brazing temperature from 1123K to 1323K and brazing time from 0.3ks to 2.7ks, the thickness of the interfacial reaction layer between the filler alloy and the Si3N4 ceramic and the size and amount of the reactant products in the filler alloy increase, leading to an increase in shear strength of the joint from 163 MPa to 276 MPa. It is also found that the fracture behavior of the Si3N4/Si3N4 joint greatly depends on the microstructure of the joint.
Key words: Si3N4 ceramic;Cu-Zn-Ti filler alloy;bonding parameters; microstructure; mechanical property