ISSN: 1003-6326
CN: 43-1239/TG
CODEN: TNMCEW

Vol. 15    No. 5    October 2005

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Capillary wave formation on excited solder jet and fabrication of lead-free solder ball
ZHANG Shu-guang(张曙光), HE Li-jun(何礼君), ZHU Xue-xin(朱学新), ZHANG Shao-ming(张少明), SHI Li-kai(石力开), XU Jun(徐 骏)
(National Engineering Research Center for Nonferrous Metals Composites, 
General Research Institute for Nonferrous Metals, Beijing 100088, China
)
Abstract:  A survey of solder ball production processes especially focusing on disturbed molten metal jet breakup process was made. Then the formation of capillary wave on tin melt jet in the way of rapid solidification was studied. A semi-empirical formula, which can be written as λ=Cvib(σ/ρ)1/3f-2/3 to predict the relationship between wavelength of capillary wave and frequency of imposed vibration was obtained. Sn-4.0Ag-0.5Cu lead free solder ball was successfully produced with tight distribution and good sphericity. The excited jet breakup process is promising for cost effectively producing solder ball.
Key words: jet; breakup; capillary wave; disturbance; solder ball 
Superintended by The China Association for Science and Technology (CAST)
Sponsored by The Nonferrous Metals Society of China (NFSOC)
Managed by Central South University (CSU) 湘ICP备09001153号-9