ISSN: 1003-6326
CN: 43-1239/TG
CODEN: TNMCEW

Vol. 16    No. 5    October 2006

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Structure and property of Cu-based thermosensitive nanocomposite
LOU Bai-yang(楼白杨), XU Bin(徐 斌), 
MA Xiao-chun(马晓春), LI Le-guo(李乐国)
(College of Mechanical and Electronic Engineering, Zhejiang University of Technology, Hangzhou 310014, China)
Abstract:  The Cu-based thermosensitive nanocomposites are made by high energy ball milling. The microstructures and properties of Cu-based thermosensitive nanocomposites are studied by transmission electron microscopy(TEM) and themosensitivity test. The effects of milling time on the microstructures and the thermosensitivity of Cu-based nanocomposite material are researched. The results show that the Cu-based nanocomposite can be made by high energy ball milling. As the milling time increases, the copper particle size decreases in the nanocomposite, then the thermoexpansivity of nanocomposite increases. The nanocomposite is of best thermoexpansivity when the milling time is up to 100 h. At 35−45 ℃, the nanocomposite shows good thermosensitivity.
Key words: Cu-based nanocomposite; thermosensitivity; microstructure; thermoexpansivity
Superintended by The China Association for Science and Technology (CAST)
Sponsored by The Nonferrous Metals Society of China (NFSOC)
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