ISSN: 1003-6326
CN: 43-1239/TG
CODEN: TNMCEW

Vol. 19    No. 4    August 2009

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Effect of polyethylene glycol on electrochemically deposited trivalent chromium layers
Joo-Yul LEE, Man KIM, Sik-Chol KWON
(Department of Surface Technology, Korea Institute of Materials Science, 531 Changwondaero, Changwon,
Gyeongnam, 641-831, Korea
)
Abstract: The structural characteristics of the trivalent chromium deposits and their interfacial behavior in the plating solution with and without polyethylene glycol molecules were observed by using various electrochemical methods such as cyclic voltammetry, open circuit potential transition, electrochemical impedance spectroscopy, scanning electron microscopy and X-ray photoelectron spectrometry. It is shown that the polyethylene glycol molecules make the reductive current density lower in the trivalent chromium plating system and promote a hydrogen evolution reaction through their adsorption on the electrode surface. And the trivalent chromium layer formed from the polyethylene glycol-containing solution has somewhat higher density of cracks on its surface and results in a lower film resistance, lower polarization resistance, and higher capacitance in a corrosive atmosphere. It is also revealed that the formation of chromium carbide layer is facilitated in the presence of polyethylene glycol, which means easier electrochemical codeposition of chromium and carbon, not single chromium deposition.
Key words: electrochemical deposition; trivalent chromium; polyethylene glycol
Superintended by The China Association for Science and Technology (CAST)
Sponsored by The Nonferrous Metals Society of China (NFSOC)
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