Modification of residual stress in Al-［AlBO］w/Al compound plate
(1. Key Laboratory for High Temperature Materials and Tests of Ministry of Education, Shanghai Jiaotong University, Shanghai 200030, P.R.China；
2. School of Materials Science and Engineering,
Harbin Institute of Technology,Harbin 150001, P.R.China)
2. School of Materials Science and Engineering,
Harbin Institute of Technology,Harbin 150001, P.R.China)
Abstract: The application of compound parts of Al-［AlBO］w/Al not only reduces the cost of the parts but also improves its properties. However, there is a large thermal residual stress between Al and ［AlBO］w/Al, and it is harmful for practical application. From the theoretical analyses and experimental results, it was found that by the compressive preplastic deformation perpendicular to the interface between Al and ［AlBO］w/Al, the interlayer residual stress of compound parts can be reduced, while the mechanical properties of compound parts can be improved.
Key words: Al-［AlBO］w/Al; compound plate; residual stress