ISSN: 1003-6326
CN: 43-1239/TG
CODEN: TNMCEW

Vol. 11    No. 3    June 2001

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Evolution of microstructure and dimension of
as-molded parts during thermal removal
process of wax-based MIM binder
LI Yi-min(李益民), HUANG Bai-yun(黄伯云), LI Song-lin(李松林),
ZENG Zhou-shan(曾舟山), QU Xuan-hui(曲选辉)
(The National Key Laboratory for Powder Metallurgy,
Central South University, Changsha 410083, P.R.China
)
Abstract:  The evolution of the microstructure and the dimension of as-molded parts were studied on the basis of the thermogravimetric analysis of wax-based MIM binder. The results show that the binder removal speeds are different in different temperature ranges during binder removal process. The evolution of the microstructure of as-molded parts during binder removal process clearly showed the initiation and formation of connected pore structure, which is the removal channel of the binder. The as-molded parts almost continuously shrank through binder removal process, except an expansion stage during 320~440 ℃, which is the dissolution expansion effect due to the dissolution of VPW in the polymer melt.
Key words:  binder; as-molded parts; microstructure; dimension
Superintended by The China Association for Science and Technology (CAST)
Sponsored by The Nonferrous Metals Society of China (NFSOC)
Managed by Central South University (CSU) 湘ICP备09001153号-9