ISSN: 1003-6326
CN: 43-1239/TG
CODEN: TNMCEW

Vol. 11    No. 3    June 2001

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Binder composition and debinding process in PIM of AlN
LIN Jian-liang(林健凉),  QU Xuan-hui(曲选辉),
  HUANG Dong-sheng(黄栋生), LI Du-xin(李笃信),  QIN Ming-li(秦明礼)
(State Key Laboratory for Powder Metallurgy,
Central South University,  Changsha 410083, P.R.China
)
Abstract:  The thermal degradation behaviors of AlN green specimens were studied by thermogravimetry analysis during the ceramic powder injection molding debinding process. The optimum binder composition and the debinding cycle were demonstrated by observing the TGA and DTA plots of AlN green specimens and analyzing the microstructure at different temperatures. By adding HDPE into the PW-EVA binder used in powder injection molding AlN can effectively reduce the mass lose rate in debinding process and improve the shape retention ability. At last, aluminum nitride ceramic with high room-temperature thermal conductivity of 162.5 W·m-1·K-1 was produced.
Key words:  aluminum nitride (AlN); ceramic powder injection molding (CIM); binder; debinding
Superintended by The China Association for Science and Technology (CAST)
Sponsored by The Nonferrous Metals Society of China (NFSOC)
Managed by Central South University (CSU) 湘ICP备09001153号-9