ISSN: 1003-6326
CN: 43-1239/TG
CODEN: TNMCEW

Vol. 11    No. 3    June 2001

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Microstructures and properties of
transient liquid phase diffusion
bonded joints of Ni3Al-base superalloy
LI Xiao-hong(李晓红), MAO Wei(毛  唯), CHENG Yao-yong(程耀永)
(Laboratory of Welding and Forging,
Beijing Institute of Aeronautical Materials,
Beijing 100095, P.R.China
)
Abstract:   An investigation of transient liquid phase (TLP) diffusion bonding of a Ni3Al-base directionally solidified superalloy, IC6 alloy, was presented. The interlayer alloy employed was Ni-Mo-Cr-B powder alloy. The results show that the microstructure of the TLP diffusion bonded joints is a combination of γ solid solution (or a γ+γ′structure) and borides. With the bonding time increasing, the quantity of the borides both in bonding seam and adjacent zones is gradually reduced, and the joint stress-rupture property is improved. The obtained stress-rupture property of the TLP bonded joints is on a level with the transverse property of IC6 base materials.
Key words:   Ni3Al-base superalloy; TLP diffusion bonding; stressrupture property
Superintended by The China Association for Science and Technology (CAST)
Sponsored by The Nonferrous Metals Society of China (NFSOC)
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