ISSN: 1003-6326
CN: 43-1239/TG
CODEN: TNMCEW

Vol. 11    No. 4    August 2001

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Thermal debinding dynamics of novel binder system
ZHOU Ji-cheng(周继承)1, HUANG Bai-yun(黄伯云)1,
ZHANG Chuan-fu(张传福)2, LIU Ye-xiang(刘业翔)2
(1. State Key Laboratory for Powder Metallurgy,
Central South University,Changsha 410083, P.R.China;
2. Department of Metallurgical Science and Engineering,
Central South University, Changsha 410083, P.R.China
)
Abstract: The thermal debinding dynamics of newly developed binders for cemented carbides extrusion molding was studied. It is shown that the thermal debinding processes can be divided into two stages: low temperature region, in which the low molecular mass components (LMMCs) are removed; and high temperature region, in which the polymer components are removed. The rate of thermal debinding is controlled by diffusion mechanism. The thermal debinding activation energies were solved out by differential method and integral method. The results show that the addition of other components acted as a catalyzer can effectively decrease the activation energy of thermal debinding processes.
Key words: plasticizing powder extrusion molding; binder; thermal debinding mechanism; non-isothermal dynamics
Superintended by The China Association for Science and Technology (CAST)
Sponsored by The Nonferrous Metals Society of China (NFSOC)
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