Bond strength of W-Cu/CuCr integrated material
(School of Materials Science and Engineering,
Xi′an University of Technology, Xi′an 710048, P.R.China)
Xi′an University of Technology, Xi′an 710048, P.R.China)
Abstract: The bond strength of W-Cu/CuCr integrated material was investigated. The results show that the fracture of W-Cu/CuCr integrated material often takes place at W-Cu/CuCr interface. Some alloying elements enhance the bond of W and CuCr alloy, which results in the increase of the strength of the W-Cu/CuCr interface. And the fracture of the W-Cu/CuCr integrated material occurs in the CuCr alloy part, not at the W-Cu/CuCr interface. Chromium in CuCr alloy part of the integrated material can improve Cr diffusing from the CuCr alloy to W-Cu composite and can be alloyed (near the W-Cu/CuCr interface) in the W-Cu composite. Thus the strength of W-Cu/CuCr interface is also increased.
Key words: bond strength； W-Cu; CuCr； integrated material