Characterization of sputter-deposited TiPdNi
thin films
thin films
(1. Key Laboratory of Ministry of Education for High Temperature Materials
and Tests, School of Materials Science and Engineering,
Shanghai Jiaotong University, Shanghai 200030, China;
2. Testing Center, Baoshan Iron & Steel Co., Ltd,
Shanghai 201900, China)
and Tests, School of Materials Science and Engineering,
Shanghai Jiaotong University, Shanghai 200030, China;
2. Testing Center, Baoshan Iron & Steel Co., Ltd,
Shanghai 201900, China)
Abstract: TiPdNi thin films were prepared by magnetron sputtering onto unheated glass and silicon substrate. Atomic force microscope, energy-dispersive X-ray microanalyzer, X-ray diffractometer, differential scanning calorimeter and optical microscope were used to characterize the films. It is found that the surface morphology of the films change during the sputtering process and a shift of about 3%Ti(mole fraction) content from the center to the edge of the substrate occurs. The freestanding asdeposited films undergo crystallization followed by three kin d s of cooling conditions. For all these heat-treated films, B2→B19→B19′ two-stage phase transformation takes place. Many Ti2Ni and Ti2Pd type of precipitates are detected in the films. The constraint films on silicon substrate are crystallized at high temperature. After crystallization, the films show a two-way shape memory effect.
Key words: TiPdNi；thin film；sputter deposition；martensitic transformation； shape memory effect