Numerical simulation of iron/TiC ceramic tappet brazed with TiZrNiCu filler metal
(National Key Laboratory of Advanced Welding Production Technology,
Harbin Institute of Technology, Harbin 150001, China)
Harbin Institute of Technology, Harbin 150001, China)
Abstract: Maximum value of thermal stress and stress concentration zones of iron/TiC ceramic tappet during cooling were studied. The results show that when the temperature is 300K, the maximum values of shear stress and tensile stress on iron/TiC ceramic interface both appear on the tip of TiZrNiCu/iron interface, so cracks always originate from TiZrNiCu/iron interface. Positive tensile stress on iron undersurface relaxes to the inner of iron and negative tensile stress on iron undersurface concentrates on the side of iron as the temperature declines, which leads to the origination of cracks on iron undersurface because of the alternation between positive and negative tensile stress.
Key words: numerical simulation; TiC ceramic; iron; brazing