Microstructure and thermal properties of recyclable Sip/1199Al composites
(School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China)
Abstract: Recyclable Sip/1199Al composites with high volume fraction of Si particles were fabricated by squeeze-casting method. The microstructure was observed and the thermal properties were tested and calculated by theoretical models. Sip/1199Al composites are all dense and macroscopically homogeneous without any particle clustering. The interface of Sip/1199Al is clean, smooth and free from any interfacial reaction products. Sip/1199Al composites have high thermal diffusivity (65.083 mm2/s) and thermal conductivity (168.211 W/(m∙ ℃)). The specific heat capacity of Sip/1199Al composites at constant pressure increases while the thermal diffusivity and thermal conductivity decrease with increasing temperature. Annealing treatment could improve the thermal properties. The results of Maxwell model and P.G. model are higher than those of experiment.
Key words: Sip/Al composite; interface; thermal conductivity