Effect of die cavity dimension on
micro U deep drawing behaviour with T2 foil
micro U deep drawing behaviour with T2 foil
(1. School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China;
2. Key Laboratory of Micro-systems and Micro-structures Manufacturing, Ministry of Education,
Harbin Institute of Technology, Harbin 150001, China)
2. Key Laboratory of Micro-systems and Micro-structures Manufacturing, Ministry of Education,
Harbin Institute of Technology, Harbin 150001, China)
Abstract: The strips U deep drawing experiments were carried out to study the effect of die cavity dimension with an extension machine manufactured by SANS company. The effects of parameters were analyzed in deep drawing process under different experimental conditions, such as punch load, reduction of thickness, angle of U part and surface quality. The experiment results show that the punch load increases with the decrease of female radius, and larger blank holder force enlarges the range of increasing. With the increasing of blank holder force, the angle of U part increases, and the reduction of foil thickness at the corner becomes larger. Obvious scratch and accumulation at the die cavity corner were observed by SEM. The investigation results indicate that micro U deep drawing of foil is affected by micro die cavity dimension.
Key words: U deep drawing; die cavity dimension effect; springback; reduction of thickness