MICROSTRUCTURES AND MECHANICAL PROPERTIES OF Ti(C, N) FILMS DEPOSITED BY PEMSIP
(1.State Key Laboratoryfor Powder Metallurgy,Central South University of Technology, Changsha 410083, P. R. China；
2.Department of Materials Science and Engineering,Dalian University of Technology, Dalian 116023, P.R.China)
2.Department of Materials Science and Engineering,Dalian University of Technology, Dalian 116023, P.R.China)
Abstract: Ti(C, N) films were deposited by Plasma Enhanced Magnetron Sputtering Ion Plating (PEMSIP), and their microstructures and properties were investigated by means of XRD,AES, TEM and scratch test.The results showed that an interlayer about 80 nm thickness was formed between the high speed steel (HSS) substrate and Ti(C, N) films. In addition, crystalline orientation relationships were found among the substrate, interlayer and Ti(C, N) films. Therefore, the Ti(C, N) films combine high hardness and excellent adhesion strength.
Key words: PEMSIP interlayer adhesion strength crystalline orientation relationship