Solder joint geometry of tin-lead alloy and its application in electronic packaging
(Shanghai Institute of Metallurgy; The Chinese Academy of Scien ces; Shanghai 200050; P. R. China；
Harbin Institute of Technology; Harbin 150001; P. R. China)
Harbin Institute of Technology; Harbin 150001; P. R. China)
Abstract: By employing the minimum energy theorem, the Potential energy controlling equation, which consists of surface energy and gravitational energy for molten meniscus, was investigated. The soder joint geometry of molten tin-lead soder alloy for chip component and thin quad flat package were simulated with finite element method. The simulation results 0f solder joint geometry are coincident well with the experimental results. The solder joint geometry was applied to study the solder joint reliability for chip component RC3216.The thermal cycling tests revealed that the solder joint geometry plays an important ro1e in solder joint reliability.
Key words: tin-lead solders; solder joint geometry; simulation; thermal cycling life