THERMAL DEBINDING OF A NEW BINDER
(1. Changsha Railway University; Changsha 410075
2.National Key Laboratory for Powder Metallurgy; Central South University of Technology; Changsha 410083)
2.National Key Laboratory for Powder Metallurgy; Central South University of Technology; Changsha 410083)
Abstract: The thermal debinding of new binder in cemented carbide's extruding compacts and its debinding mechanism have been studied here. When the low molecular mass components (LMMC) in these new binder systems are changed, their thermogravimetric analysis (TGA) curves are very different. As the paraffin wax is the main LMMC, the new binder has been removed in two different temperature zones; while the temperature is at 240 ℃, the LMMC have been almost totally debinded. When a kind of short time polymer X is the main LMMC, there are no zones of low temperature debinding in the TGA curves. The differential thermal analysis curves show that a new single phase microstructural material composing with X and polymer A has been made in these cases.
Key words: cemented carbide extrusion pressing binder formulation thermal debnding