ISSN: 1003-6326
CN: 43-1239/TG
CODEN: TNMCEW

Vol. 4    No. 4    December 1994

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CAUSE OF FORMATION OF NODULAR COPPER PARTICLES ON ELECTROREFINED COPPER SUBSTRATE
Lin Jianxin1; Li Xueliang1; Chen Hanhe1; He Jianbo1; Wu Jilie2
(1.Hefei Polytechnical University; Hefei 230009
2.Guixi Smeltery; Guixi 335424
)
Abstract: The microanalysis by EDAX and XPS is used to identify elements and their valences of the initial growth sites of nodular copper particles on electrodeposited copper.Crystal orientation and the copper sheet cut out along the growth axes of nodular copper particles are also studied by EDAX and XPS.It shows that the adhesion of some suspended slime, such as copper and silver corpuscles, oxides of arsenic,antimony,bismuth and copper, sulfides of copper, makes crystal face(220) be preferred orientation and cause the growth of nodular copper particles.  Nonconductor corpuscles such as silicates,calcium and magnesium sulphates would not produce nodulation and are occluded in electrodeposited copper.
Key words: copper electrorefining nodular copper particle XPS EDAX
Superintended by The China Association for Science and Technology (CAST)
Sponsored by The Nonferrous Metals Society of China (NFSOC)
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