Microstructure and electric properties of Sip/Al composites for
electronic packaging applications
electronic packaging applications
(School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China)
Abstract: Sip/1199, Sip/4032 and Sip/4019 environment-friendly composites for electronic packaging applications with high volume fraction of Si particles were fabricated by squeeze-casting technology. Effects of microstructure, particle volume fraction, particle size, matrix alloy and heat treatment on the electrical properties of composites were discussed, and the electrical conductivity was calculated by theoretical models. It is shown that the Si/Al interfaces are clean and do not have interface reaction products. For the same matrix alloy, the electrical conductivity of composites decreases with increasing the reinforcement volume fraction. As for the same particle content, the electrical conductivity of composites decreases with increasing the alloying element content of matrix. Particle size has little effects on the electrical conductivity. Electrical conductivity of composites increases slightly after annealing treatment. The electrical conductivity of composites calculated by P.G model is consistent with the experimental results.
Key words: Si/Al composite; microstructure; electric conductivity; electronic packaging