ISSN: 1003-6326
CN: 43-1239/TG
CODEN: TNMCEW

Vol. 20    No. 11    November 2010

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Microstructure and performance of Al-Si alloy with high Si content by
high temperature diffusion treatment
XIU Zi-yang (修子扬), CHEN Guo-qin(陈国钦), WANG Xiao-feng(王晓峰),
WU Gao-hui(武高辉), LIU Yan-mei(刘艳梅), YANG Wen-shu(杨文澍)
(School of Material Science and Engineering, Harbin Institute of Technology, Harbin 150001, China)
Abstract: The Al-Si alloy with high Si content was prepared by pressure infiltration. Microstructure observation shows that three-dimensional structure (3D-structure) is obtained from irregular sharp Si particles via high temperature diffusion treatment (HTDT). Flat Si-Al interfaces transform to smooth curves, and Si phases precipitate in Al and Si-Al interface. The bonding of Si-Al interface is improved by HTDT, which improves the mechanical performance of Al-Si alloy. The bending strength of 3D-Al-Si alloy increases by 6% compared with that of Al-Si alloy, but the elastic modulus changes a little. The coefficient of thermal expansion (CTE) of the 3D-Al-Si alloy is 7.7×10−6/°C from 20 °C to 100 °C, which decreases by 7% compared with that of Al-Si alloy. However, HTDT has little effect on the thermal conductivity of Al-Si alloy.
Key words: Al-Si alloy; 3D-structure; interface; diffusion
Superintended by The China Association for Science and Technology (CAST)
Sponsored by The Nonferrous Metals Society of China (NFSOC)
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