Effect of bonding parameters on microstructures and properties during TLP bonding of Ni-based super alloy
(1. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;
2. School of Chemical Engineering and Technology, Harbin Institute of Technology, Harbin 150001, China)
2. School of Chemical Engineering and Technology, Harbin Institute of Technology, Harbin 150001, China)
Abstract: Ni-based alloy was transient liquid phase bonded using a BNi-2 interlayer. The effect of bonding parameters on the microstructures and mechanical properties of the joints was investigated. With the increase of bonding temperature or time, the number of Ni-rich and Cr-rich borides and the grain size of precipitation zone decrease. Higher bonding temperature or longer bonding time is beneficial to the diffusion of melting point depressant elements (B and Si) from the PZ to the base metal and atomic interdiffusion between the base metal and the joint. The chemical composition and microstructure of the joints bonded at 1170 °C for 24 h are comparable to the base metal. The shear test results show that both the room and elevated temperature shear-strengths of the joints increase with increasing bonding time. However, the effect of bonding time on elevated temperature tensile-shear strength is greater than on room temperature tensile-shear strength.
Key words: Ni-based alloy; transient liquid phase bonding; microstructure; tensile-shear strength