ISSN: 1003-6326
CN: 43-1239/TG
CODEN: TNMCEW

Vol. 22    No. 11    November 2012

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Structure characteristic and its evolution of Cu-W films prepared by dual-target magnetron sputtering deposition
ZHOU Ling-ping1, 2, WANG Ming-pu1, 3, PENG Kun2, ZHU Jia-jun2, FU Zhen1, LI Zhou1
(1. School of Materials Science and Engineering, Central South University, Changsha 410083, China;
2. College of Materials Science and Engineering, Hunan University, Changsha 410082, China;
3. Key Laboratory of Nonferrous Metal Materials Science and Engineering,
Ministry of Education, Changsha, 410083, China
)
Abstract: Immiscible Cu-W alloy thin films were prepared using dual-target magnetron sputtering deposition process. The structure evolution of Cu-W thin films during preparation was investigated by X-ray diffraction,transmission electron microscopy and high resolution transmission electron microscopy. In the initial stage of dual-target magnetron sputtering deposition process, an amorphous phase formed; then it crystallized and the analogy spinodal structure formed due to the bombardment of the sputtered particles during sputtering deposition process, the surface structure of the film without the bombardment of the sputtered particles was the amorphous one, the distribution of the crystalline and amorphous phase showed layer structure. The solid solubility with the analogy spinodal structure was calculated using the Vegard law. For Cu-13.7%W (mole fraction) film, its structure was composed of Cu-11%W solution, Cu-37%W solution and pure Cu; for Cu-14.3%W film, it was composed of Cu-15%W solution, Cu-38%W solution, and pure Cu; for Cu-18.1%W film, it was composed of Cu-19%W solution, Cu-36% W solution and pure Cu.
Key words: Cu-W thin film; sputtering deposition; amorphous phase; layer structure; solid solubility; Vegard law
Superintended by The China Association for Science and Technology (CAST)
Sponsored by The Nonferrous Metals Society of China (NFSOC)
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