Effect of residual-stress on microyield behavior of Al alloy reinforced by SiCp
(1.College of Material Science and Engineering, Nanchang Institute of Aeronautical Technology, Nanchang 330034, China2.College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016,China)
Abstract: Because of the difference in the coefficient of thermal expansion of Al alloy and SiCp, the residual-stress generates during the process of fabricating Al alloy reinforced by SiCp. The analyzing residual-stress quantitatively by XRD shows that residual-stress is essential character of Al alloy reinforced by SiCp, and the residual-stress in Al alloy matrix is tensile stress. The residual-stress decreases along with lessening of SiCp size, which shows better microyield behavior. In annealing, the residual-stress of LY12+150#SiCp is lower than that of ZL101+150#SiC, thus it has better microyield behavior. The residual-stress of solution-aging is bigger than that of annealing. The microyield behavior is also explained from the parameter change of microstructure to microyield behavior. Space-group relative microdistortion of Al alloy reinforced decreases along with lessening of SiCp size, which has good microyield behavior.
Key words: microyield； SiCp； space-group relative microdistortion； XRD； residual-stress