Microstructure and thermal and electric conductivities of high dense Mo/Cu composites
(1.School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China2.哈尔滨工业大学材料科学与工程学院，哈尔滨150001)
Abstract: For electronic packaging applications, Mo/Cu composites with volume fractions of 55%, 60% and 67% Mo were fabricated by the patented squeeze-casting technology. The microstructures and thermal and electric conduction properties of the Mo/Cu composites were investigated. The results show that Mo particles are homogeneous and uniform, and the Mo-Cu interfaces are clean and free from interfacial reaction products and amorphous layers; the densifications of the Mo/Cu composites are higher than 99%. The thermal conductivities of Mo/Cu composites range from 220 to 270W/(m·℃) and decrease with an increase in volume fraction of Mo content. The thermal conductivities agree well with the predicted values of theoretical models. The electric conductivities of Mo/Cu composites are in the range of 2228MS/m and decrease with the increase of Mo content. The achievement of higher thermal and electric conduction is attributed to the full densities and high purity Mo/Cu composites, which are attained through the cost-effective squeeze-casting technology processes.
Key words: Mo/Cu composites； microstructure； densification； thermal conductivity； electric conductivity