Thermo-physical properties of Sip/LD11 composites for electronic packaging
(1.黑龙江省哈尔滨市哈尔滨工业大学材料科学与工程学院2.School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China)
Abstract: The Sip/LD11 composites with high volume fraction of silicon particles were fabricated by squeeze-casting technique. Microstructure observations indicate that the composites are dense and homogenous. With the increasing of volume fraction, both the CTEs and thermo-conductivity of Sip/LD11 are decreased. The CTEs of Sip/LD11 can be adjusted between 8.3×10-6-12×10-6/℃, and the thermal conductivity is larger than 87.7W/ (m·℃). This meets the requirements of electronic packaging material. The CTEs of Sip/LD11 lie between ROM model and Turner model, but the Kerner model can predict the CTEs of Sip/LD11 more precisely. The calculated results of thermal conductivity are larger than the measured results.
Key words: Si particles； aluminum matrix composite； thermal expansion； thermal conductivity