Oxidized film on Cp/Cu-Cd electrical contact material
(1.黑龙江省哈尔滨市哈尔滨工业大学材料科学与工程学院2.School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China3.Department of Materials Science and Engineering, Tsinghua University, Beijing 100084, China4.School of Materials Science and Technology, Harbin Institute of Technology, Harbin 150001, China)
Abstract: Constituents of the oxidized surface film on diamond particles reinforced Cu-Cd alloy matrix composite （Cp/Cu-Cd） were investigated by XPS. The results show that Cu2O is the main constituent when the oxidized film is thin; CuO appears only after the film is rather thick. The originally formed oxidized film on the Cp/Cu-Cd is about 10nm in thickness and is mainly composed of Cu2O and Cu. After oxidized at 120℃ over 30h, CuO is detected in the film.
Key words: Cu-based composites； electrical contact materials； XPS； oxidation