Interfacial reaction and growth behavior of reaction layer of Si3N4/Si3N4 joint brazed by Cu-Zn-Ti filler alloy
(3.Joining and Welding Research Institute, Osaka University, Ibaraki, Osaka 567-0047, Japan)
Abstract: Si3N4 ceramic was jointed to itself using a filler alloy of Cu-Zn-Ti by the reaction between Ti and Si3N4. The microstructure of the interface in the joint is found to be Si3N4 ceramic/TiN reaction layer/Ti5Si3 reaction layer. The grain size of the TiN and Ti5Si3 reaction layer is 0.1μm and 1-2μm, respectively. There is no crystal orientation relationship between TiN reaction layer and Si3N4 ceramic or Ti5Si3 reaction layer. The kinetic equation for calculating the thickness of the reaction layer was obtained. When a （CuZn）85Ti15 alloy is used as the filler alloy, the apparent activation energy of the growth of the reaction layer is 201.69kJ/mol.
Key words: Si3N4 ceramic； Cu-Zn-Ti filler alloy； interfacial reaction； kinetic