Hot deformation behavior of novel imitation-gold copper alloy
(1. School of Materials Science and Engineering, Central South University, Changsha 410083, China;2. Key Laboratory of Nonferrous Metal Materials Science and Engineering ofMinistry of Education, Changsha 410083, China)
Abstract: The hot deformation behavior of a novel imitation-gold copper alloy was investigated with Gleeble-1500 thermo-mechanical simulator in the temperature range of 650-770 °C and strain rate range of 0.001-1.0 s-1. The hot deformation constitutive equation was established and the thermal activation energy was obtained to be 249.60 kJ/mol. The processing map at a strain of 1.2 was developed. And there are two optimal regions in processing map, namely 650-680 °C, 0.001-0.01 s-1 and 740-770 °C, 0.01-0.1 s-1. Optical microscopy was employed to investigate the microstructure evolution of the alloy in the process of deformation. Recrystallized grains and twin crystals were found in microstructures of the hot deformed alloy.
Key words: imitation-gold alloy; hot compression deformation; constitutive equation; processing map