Effects of alloying and deformation on microstructures and properties of Cu-Mg-Te-Y alloys
(School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China)
Abstract: New copper alloys with high mechanical properties and high electrical conductivity were prepared, and the effects of addition of minor Mg and Y elements on microstructures and properties were studied. The high tensile strength of above 510 MPa, high elongation of 11% and high electrical conductivity of over 63% IACS can be simultaneously obtained in Cu-0.47Mg-0.20Te- 0.04Y alloy after deforming and annealing treatment. Effects of purification together with the grain refining by Y and solid-solution strengthening by Mg are appropriate for enhancing mechanical properties and electrical conductivity of the copper alloys.
Key words: Cu-Mg-Te-Y alloys; alloying; deformation; mechanical properties; electrical conductivity