ISSN: 1003-6326
CN: 43-1239/TG
CODEN: TNMCEW

Vol. 26    No. 7    July 2016

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Diffusion bonding of Al 7075 and Mg AZ31 alloys: Process parameters, microstructural analysis and mechanical properties
Seyyed Salman SEYYED AFGHAHI1, Mojtaba JAFARIAN2, Moslem PAIDAR3, Morteza JAFARIAN2
(1. Department of Engineering, Faculty of Materials Science and Engineering,
Imam Hossein University, Tehran 15816-18711, Iran;
2. Young Researchers and Elite Club, Science and Research Branch, Islamic Azad University, Tehran 14515775, Iran;
3. Department of Material Engineering, South Tehran Branch, Islamic Azad University, Tehran 1459853849, Iran
)
Abstract: Al 7075 and Mg AZ31 alloys were joined by diffusion bonding method. Joining process was performed in pressure range of 10-35 MPa at temperatures of 430-450 °C for 60 min under a vacuum of 13.3 MPa. The microstructure evaluation, phase analysis and distribution of elements at the interface were done using scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDS) and X-ray diffraction (XRD). The pressure of 25 MPa was determined as the optimum pressure in which the minimum amount of plastic deformation takes place at the joint. Different reaction layers containing intermetallic compounds, such as Al12Mg17, Al3Mg2 and α(Al) solid solution, were observed, in interfacial transition zone (ITZ). Thickness of layers was increased with increasing the operating temperature. According to the results, diffusion of aluminum atoms into magnesium alloy was more and the interface movement towards the Al alloy was observed. The maximum bond strength of 38 MPa was achieved at the temperature of 440 °C and pressure of 25 MPa. Fractography studies indicated that the brittle fracture originated from Al3Mg2 phase.
Key words: Al 7075 alloy; Mg AZ31 alloy; diffusion bonding; intermetallic compounds; interfacial transition zone; microstructure; mechanical properties
Superintended by The China Association for Science and Technology (CAST)
Sponsored by The Nonferrous Metals Society of China (NFSOC)
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