ISSN: 1003-6326
CN: 43-1239/TG

Vol. 26    No. 12    December 2016

Formation and growth of Cu-Al IMCs and their effect on electrical property of electroplated Cu/Al laminar composites
Jian ZHANG1, Bin-hao WANG1, Guo-hong CHEN2, Ruo-min WANG2, Chun-hui MIAO2, Zhi-xiang ZHENG1, Wen-ming TANG1
(1. School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China;
2. Anhui Institute of Electric Power Science, State Grid, Hefei 230601, China
Abstract: Cu/Al laminar composite was prepared by dipping Zn layer and then electroplating Cu thick layer on pure Al sheet. During annealing the Cu/Al composites at temperature from 473 to 673 K, the Cu/Al interfacial diffusion and reaction and its kinetics and also the electrical resistivity of the composites were studied. The results show that no Cu-Al IMC layer is observable as the composites are annealed at 473 K for time till 360 h, indicating that the Zn intermediate layer can effectively suppress the Cu/Al interfacial diffusion. However, as the composites are annealed at 573 K and above, Zn atoms in the Zn layer dissolve into the Cu layer. Tri-layered reaction product of CuAl2/CuAl/Cu9Al4 then forms from the Al side to the Cu side. The IMC layer follows the diffusion-controlled growth kinetics. Electrical resistivity of the Cu/Al composites increases with the increase of the annealing temperature and time.
Key words: Cu-Al intermetallics; laminar composite; electroplating; interfacial reaction; growth kinetics; electrical resistivity
Superintended by The China Association for Science and Technology (CAST)
Sponsored by The Nonferrous Metals Society of China (NFSOC)
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