ISSN: 1003-6326
CN: 43-1239/TG
CODEN: TNMCEW

Vol. 27    No. 9    September 2017

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Diffusional bonds in laminated composites produced by ECAP
I. ANSARIAN, M. H. SHAERI
(Department of Metallurgy and Materials Engineering, Engineering Faculty, Imam Khomeini International University, Qazvin 34149-16818, Iran)
Abstract: The microstructure, diffusional and mechanical bonding behavior and microhardness distribution of laminated composites fabricated by ECAP process were investigated. Al-Cu and Cu-Ni laminated composites were produced by ECAP process up to 4 passes at room temperature and high temperature (300 °C). The results of microstructure characterization by SEM and shear strength test revealed that the joints between the layers of 4-pass ECAPed samples were considerably stronger than those of 1-pass ECAPed samples due to tolerating higher values of plastic deformations during ECAP. Furthermore, shear strength data showed that increasing ECAP temperature caused a notable increase in shear strength of the specimens. The reason lies in the formation of diffusional joint between the interface of both Al/Cu and Cu/Ni layers at high temperature. The shear bonding strength of ECAPed Cu/Ni/Cu composite at high temperature was remarkably higher than that of ECAPed Cu/Al/Cu composite.
Key words: equal channel angular pressing; shear strength; laminated composites; diffusional joint
Superintended by The China Association for Science and Technology (CAST)
Sponsored by The Nonferrous Metals Society of China (NFSOC)
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