Direct active soldering of Al0.3CrFe1.5MnNi0.5 high entropy alloy to 6061-Al using Sn-Ag-Ti active solder
(1. Department of Materials Engineering, National Pingtung University of Science & Technology, Neipu, Pingtung 91201, China;
2. Department of Mechanical Engineering, National Yunlin University of Science & Technology, Touliu, Yunlin 64002, China)
Abstract: Al0.3CrFe1.5MnNi0.5 high entropy alloys (HEA) have special properties. The microstructures and shear strengths of HEA/HEA and HEA/6061-Al joints were determined after direct active soldering (DAS) in air with Sn3.5Ag4Ti active filler at 250 °C for 60 s. The results showed that the diffusion of all alloying elements of the HEA alloy was sluggish in the joint area. The joint strengths of HEA/HEA and HEA/6061-Al samples, as analyzed by shear testing, were (14.20±1.63) and (15.70±1.35) MPa, respectively. Observation of the fracture section showed that the HEA/6061-Al soldered joints presented obvious semi-brittle fracture characteristics.
Key words: high entropy alloy; Sn3.5Ag4Ti active filler; Al0.3CrFe1.5MnNi0.5; direct active soldering