Effect of porosity and interface structures on thermal and mechanical properties of SiCp/6061Al composites with high volume fraction of SiC
(1. School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China;
2. Institute of Industry & Equipment Technology, Hefei University of Technology, Hefei 230009, China;
3. Laboratory of Nonferrous Metal Material and Processing Engineering of Anhui Province, Hefei University of Technology, Hefei 230009, China;
4. National-Local Joint Engineering Research Centre of Nonferrous Metals and Processing Technology, Hefei University of Technology, Hefei 230009, China)
2. Institute of Industry & Equipment Technology, Hefei University of Technology, Hefei 230009, China;
3. Laboratory of Nonferrous Metal Material and Processing Engineering of Anhui Province, Hefei University of Technology, Hefei 230009, China;
4. National-Local Joint Engineering Research Centre of Nonferrous Metals and Processing Technology, Hefei University of Technology, Hefei 230009, China)
Abstract: 50 vol.% SiCp/Al composites with high thermal and mechanical properties were successfully produced by spark plasma sintering technique. The influences of sintering temperature on the thermal conductivity, coefficient of thermal expansion and bending strength of the SiCp/Al composites were carefully investigated. The results show that the SiCp/Al composites sintered at 520 °C exhibits a thermal conductivity of 189 W/(m·K), a coefficient of thermal expansion (50-200 °C) of 10.03×10-6 K-1 and a bending strength of 649 MPa. The high thermal and mechanical properties can be ascribed to the nearly full density and the well interfacial bonding between the alloy matrix and the SiC particles. This work provides a promising pathway for producing materials to meet the needs of high performance electronic packaging.
Key words: spark plasma sintering; SiCp/6061Al composites; thermal properties; mechanical properties