ISSN: 1003-6326
CN: 43-1239/TG
CODEN: TNMCEW

Vol. 29    No. 9    September 2019

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Microstructure evolution of Al-Cu-Mg alloy during rapid cold punching and recrystallization annealing
Ze-yi HU1, Cai-he FAN1, Dong-sheng ZHENG1, Wen-liang LIU1, Xi-hong CHEN2
(1. College of Metallurgy and Material Engineering, Hunan University of Technology, Zhuzhou 412007, China;
2. CRRC Zhuzhou Electric Locomotive Co., Ltd., Zhuzhou 412007, China
)
Abstract: The microstructure evolution of spray formed and rapidly solidified Al-Cu-Mg alloy with fine grains during rapid cold punching and recrystallization annealing was investigated by transmission electron microscopy (TEM). The results show that the precipitates of fine-grained Al-Cu-Mg alloy during rapid cold punching and recrystallization annealing mainly consist of S phase and a small amount of coarse Al6Mn phase. With the increase of deformation passes, the density of precipitates increases, the size of precipitates decreases significantly, and the deformation and transition bands disappear gradually. In addition, the grains are refined and tend to be uniform. Defects introduced by rapid cold punching contribute to the precipitation and recrystallization, and promote nucleation and growth of S phase and recrystallization. Deformation and transition bands in the coarse grains transform into deformation-induced grain boundary during the deformation and recrystallization, which refine grains, obtain uniform nanocrystalline structure and promote homogeneous distribution of S phase.
Key words: Al-Cu-Mg alloy; microstructure evolution; precipitate; recrystallization; deformation band; rapid cold punching
Superintended by The China Association for Science and Technology (CAST)
Sponsored by The Nonferrous Metals Society of China (NFSOC)
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