Microstructure and mechanical properties of CuAgZn/GH909 diffusion bonded joint fabricated by hot isostatic pressing
(School of Mechanical Engineering and Automation, Beihang University, Beijing 100191, China)
Abstract: The hot isostatic pressing-diffusion bonding (HIP-DB) was proposed to achieve the joining of CuAgZn and GH909 directly without an interlayer. The microstructure of joint was characterized by scanning electron microscope (SEM), energy dispersive spectrometer (EDS) and X-ray diffraction (XRD). The microhardness and shear strength were tested to investigate the mechanical properties of joint. The results showed that the interface was complete, and the joint was compact, uniform and free of unbonded defects. The maximum microhardness of joint was HV 443, higher than that of two base alloys, and the average shear strength of joint reached 172 MPa. It is concluded that a good metallurgical bonding between CuAgZn and GH909 can be obtained by HIP-DB with the process parameters of 700 °C,150 MPa and 3 h.
Key words: CuAgZn alloy; GH909 superalloy; diffusion bonding; hot isostatic pressing