PDF(5765 KB)
铜中无骨架填充Cr和W电触头复合材料的智能显微组织
L. E. BODROVA, S. Yu. MELCHAKOV, A. B. SHUBIN, E. Yu. GOYDA
中国有色金属学报(英文版) ›› 2021, Vol. 31 ›› Issue (9) : 2773-2786.
PDF(5765 KB)
PDF(5765 KB)
铜中无骨架填充Cr和W电触头复合材料的智能显微组织
({{custom_author.role_cn}}), {{javascript:window.custom_author_cn_index++;}}Smart-microstructures of composites for electrical contacts with frameless packing of Cr and W in copper
({{custom_author.role_en}}), {{javascript:window.custom_author_en_index++;}}| {{custom_ref.label}} |
{{custom_citation.content}}
{{custom_citation.annotation}}
|
/
| 〈 |
|
〉 |