PDF(8137 KB)
Cu含量对Sn-xCu无铅焊料显微组织、晶粒取向和力学性能的影响
KannachaiKANLAYASIRI,NiwatMOOKAM
中国有色金属学报(英文版) ›› 2022, Vol. 32 ›› Issue (4) : 1226-1241.
PDF(8137 KB)
PDF(8137 KB)
Cu含量对Sn-xCu无铅焊料显微组织、晶粒取向和力学性能的影响
({{custom_author.role_cn}}), {{javascript:window.custom_author_cn_index++;}}Influence of Cu content on microstructure, grain orientation and mechanical properties of Sn-xCu lead-free solders
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