Electrochemical characteristic of chemical-mechanical polishing of copper with oxide passive film

HEHan-wei(何捍卫),HUYue-hua(胡岳华),ZHOUKe-chao(周科朝),XIONGXiang(熊翔),HUANGBai-yun(黄伯云)

中国有色金属学报(英文版) ›› 2003, Vol. 13 ›› Issue (04) : 977-981.

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中国有色金属学报(英文版) ›› 2003, Vol. 13 ›› Issue (04) : 977-981.
MINING, MINERAL PROCESSING, METALLURGY AND CHEMIST

Electrochemical characteristic of chemical-mechanical polishing of copper with oxide passive film

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Electrochemical characteristic of chemical-mechanical polishing of copper with oxide passive film

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{{article.zuoZheCn_L}}. {{article.title_cn}}[J]. {{journal.qiKanMingCheng_CN}}, 2003, 13(04): 977-981
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