PDF(3338 KB)
Sn–xAg无铅焊料中Ag 含量对其显微组织、腐蚀行为和与Cu基体界面反应的影响
Phacharaphon TUNTHAWIROON, Kannachai KANLAYASIRI
中国有色金属学报（英文版） ›› 2019, Vol. 29 ›› Issue (8) : 1696-1704.
PDF(3338 KB)
PDF(3338 KB)
Sn–xAg无铅焊料中Ag 含量对其显微组织、腐蚀行为和与Cu基体界面反应的影响
({{custom_author.role_cn}}), {{javascript:window.custom_author_cn_index++;}}Effects of Ag contents in Sn–xAg lead-free solders on microstructure, corrosion behavior and interfacial reaction with Cu substrate
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