PDF(4911 KB)
PDF(4911 KB)
PDF(4911 KB)
热等静压扩散连接CuAgZn/GH909接头组织及力学性能
({{custom_author.role_cn}}), {{javascript:window.custom_author_cn_index++;}}Microstructure and mechanical properties of CuAgZn/GH909 diffusion bonded joint fabricated by hot isostatic pressing
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