电子封装用Al-Si功能梯度材料的显微组织和性能
周玮,王日初,彭超群,蔡志勇,
Microstructure and properties of Al-Si functionally graded materials for electronic packaging
WeiZHOU,Ri-chuWANG,Chao-qunPENG,Zhi-yongCAI,
中国有色金属学报(英文版)
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2023, (12): 3583
-3596
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DOI: 10.1016/S1003-6326(23)66356-3