Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad
WANGJian-xin(王俭辛),XUESong-bai(薛松柏),FANGDian-song(方典松), JUJin-long(鞠金龙),HANZong-jie(韩宗杰),YAOLi-hua(姚立华)<
Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad
WANGJian-xin(王俭辛),XUESong-bai(薛松柏),FANGDian-song(方典松), JUJin-long(鞠金龙),HANZong-jie(韩宗杰),YAOLi-hua(姚立华)<
中国有色金属学报（英文版）
.
2006, (06): 1374
-1378
.
