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Finite element simulation for mechanical
response of surface mounted solder joints
under different temperature cycling
MAXin(马鑫),QIANYi-yu(钱乙余),F.Yoshida
Finite element simulation for mechanical
response of surface mounted solder joints
under different temperature cycling
MAXin(马鑫),QIANYi-yu(钱乙余),F.Yoshida
中国有色金属学报(英文版) . 2001, (04): 471 -474 .