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Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys
匿名
Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys
ZHAOXiao-yan(赵小艳),ZHAOMai-qun(赵麦群),CUIXiao-qing(崔小清),XUTian-han(许天旱),TONGMing-xin(仝明信)
中国有色金属学报(英文版) . 2007, (04): 805 -805 .