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Diffusion bonding of copper alloy to stainless steel with Ni and Cu interlayer①
YU Zhi-shui(于治水), WANG Feng-jiang(王凤江), LI Xiao-quan(李晓泉), WU Ming-fang(吴铭芳)
Diffusion bonding of copper alloy to stainless steel with Ni and Cu interlayer①
YU Zhi-shui(于治水), WANG Feng-jiang(王凤江), LI Xiao-quan(李晓泉), WU Ming-fang(吴铭芳)
中国有色金属学报(英文版) . 2000, (01): 88 -91 .